TECHNOLOGY

技术介绍

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技术介绍

"Scribing and Breaking (S&B)" is a method for efficiently cutting materials such as glass, ceramics, and semiconductors. By utilizing the hard and brittle characteristics of the material and processing using crack growth, a quality different from that of conventional processing technology can be obtained. If you have any problems with the processing so far, or if you want to change the quality, please contact us once.

Features

生産性 製品品質

Scribing and Breaking process 

S&B加工
スクライブ後
ブレーク後
エキスパンド後

Processing Animation

S&B Processing flow

Scribing Processing mechanism

Breaking Processing mechanism

Difference from conventional processing

Scribing and Breaking process

スクライブ加工イメージ

A process that propagates cracks in the substrate material by applying a load to a tool with a diameter of 2 mm (processing that does not scrape).

<<加工写真(アルミナ メタライズ基板)>>

Through hole

<<Front side>>

Through hole

No kerf-loss

<<Back side>>

Through hole

No metal burr

No chipping

<<An example of a scribing line>>

Through hole

Dicing process

従来加工イメージ

A process that scrapes off the substrate material by rotating the grindstone (blade) at high speed.

 

Through hole

 

Through hole

Kerf-loss

 

Through hole

Metal burr (Height about 5um)

Chipping

List of materials that can be processed

Alumina

LTCC(Low-temperature cofired ceramics)

AlN

SiN

Zirconia

Dielectric

Glass

Sapphire

SiC

Various materials can be processed.

WORKS

Reference

WORKS

"割断;划线&裂片(S&B)"是一种高效切割玻璃·陶瓷·半导体等材料的方法。
运用材料本身硬脆的特性及裂纹扩展来进行加工,从而获得不同于传统加工技术的品质。
若您在加工过程中遇到任何问题或想改善品质,请与我们联系。

特征

生産性 製品品質

S&B加工

S&B加工
スクライブ後
ブレーク後
エキスパンド後

加工动画

S&B加工流程

划线加工机构

裂片加工机构

与传统加工的区别

S&B加工

スクライブ加工イメージ

通过对直径为2mm的工具施加负荷,在基板材料上产生裂纹的加工(不切割的加工)

<<加工写真(アルミナ メタライズ基板)>>

Through hole

<<前面側>>

Through hole

没有缺口损失

<<裏面側>>

Through hole

没有金属毛刺

没有崩边

<<划线示例>>

Through hole

传统加工

従来加工イメージ

通过高速旋转砂轮(刀刃)来切割基板材料的加工

 

Through hole

 

Through hole

有缺口损失

 

Through hole

有金属毛刺(高度约5um)

有崩边

可加工材料一览

氧化铝

低温共烧陶瓷

氮化鋁

氮化硅

氧化锆

电介质

玻璃

蓝宝石

碳化硅

各式材料皆可加工。

加工实例

参考文献列表

加工实例